distant spots: Static models are usually situated remotely, escalating Expense and lowering Over-all system performance.
Tool & TCU software package calibration processes change exterior check tools not applied routinely for verifying
Together with the POU3500, you could attain unprecedented leads to etch efficiency, chamber uptime, minimized cost of possession and fab House utilization – all although bettering your system trustworthiness.
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LAUDA-Noah will, for any consumer's retrofit analysis, monitor and adjust its fluid temperature Command profiles to match an present TCUs' so as to ensure a clean method integration through DAQ.
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The accuracy from the POU 3500 permits independent Charge of the procedure fluid temperature on the wafer chuck in +/- 0.one °C of set position, along with the quick reaction time with the method allows for maximum wafer-to-wafer repeatability all through the etch process.
Using the POU3300, you could reach unprecedented leads to etch overall performance, chamber uptime, minimized price of possession and fab Place utilization – all although bettering your process trustworthiness.
Large Footprint: Static models occupy considerable Place in the fabrication Software area, reducing its efficiency.
Dynamic Temperature Manage, as carried out in programs such as LAUDA-Noah POU, is an tactic that senses the temperature of the process fluid getting back from the process chamber’s wafer chuck (ESC) and dynamically adjusts the temperature from the equipped approach fluid based upon this serious-time comments.
The TEs' can change directly from heating to cooling, or visa-versa. they're able to turn on & off while within the heating or cooling mode and can raise or lessen the level of heating or cooling with no switching by any means.
The POU3300 process gives dynamic temperature Charge of the method chamber cathode / electrode / anode and might be synchronized with click here any etch course of action.
the truth is the fact that true Dynamic Temperature Regulate can only be accomplished when all five (5) of the next system design and style and set up specifications are achieved:
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